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Organizer
This symposium is hosted by Center for Advanced Low-dimensional Materials (CALM) and State Key Laboratory for Modification of Chemical Fibers and Polymer Materials (SKLFPM), Donghua University. 

  

Center for Advanced Low-dimension Materials (CALM), established in October 2015, is a research institute directly-affiliated with Donghua University (DHU). Professor Stephen Z.D. Cheng, the leader in the international macromolecule physics and member of the U.S. National Academy of Engineering, serves as the director and chief scientist of CALM. Advanced low-dimensional materials, which pursue the performance limit of material - finer, thinner, lighter, softer and stronger, promote deep changes in the fields of life and health, intelligent life, aerospace, deep under-ground and deep sea explorations. To be recognized as one of the best academic programs in China, for our positive impact on humanity through contributions to and leadership in developing new advanced low dimensional materials.
Get more details on this website: http://calm.dhu.edu.cn/main.psp



            

State Key Laboratory for Modification of Chemical Fibers and Polymer Materials (SKLFPM), based on Donghua University, was established in 1992, passed the national acceptance in 1996, and passed the national assessment three times in 2003, 2008 and 2013. It is an important national-level research base in the field of fiber and polymer materials. Relying on the materials science and engineering disciplines of Donghua University, the laboratory is focused on the frontier of international fiber technology, national strategic needs and international livelihood needs. SKLFPM breaks foreign monopoly in the field of high-performance fiber, leads the civil fiber industry to exceed the international advanced level, and has made important contributions to the development of biomass fiber and inorganic fiber.
Get more details on this website:http://sklfpm.dhu.edu.cn/
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Key Dates
   Conference Time:
   Nov. 20th-24th, 2019

   Online Registration Deadline:
   Oct. 31st, 2019 

   On-site Registration Deadline:
   Nov. 20th, 2019